manuais NEC N8101-732F

Nec N8101-732F Ficha Técnica (216 páginas)

Marca: Nec | Categoria: Processadores | Tamanho: 2.64 MB |

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Índice

Product Family

1

Table of Contents

3

Datasheet Volume One

10

Revision History

11

1 Overview

13

1.1.2 Supported Technologies

14

1.2 Interfaces

15

1.2.2 PCI Express*

16

Transaction

17

Overview

18

1.3 Power Management Support

19

1.5 Package Summary

20

1.6 Terminology

20

1.7 Related Documents

22

1.9 State of Data

23

2 Interfaces

24

2.2 PCI Express* Interface

25

2.2.1.1 Transaction Layer

26

2.2.1.2 Data Link Layer

26

2.2.1.3 Physical Layer

26

2.3.1 DMI2 Error Flow

27

2.3.3 DMI2 Link Down

27

Interfaces

28

2.5.1.1 Thermal Management

30

2.5.2.1 Ping()

30

2.5.2.2 GetDIB()

31

Reserved

32

# of Domains

32

Byte# 5

32

2.5.2.3 GetTemp()

33

2.5.2.4 RdPkgConfig()

34

2.5.2.5 WrPkgConfig()

35

DRAM Power Limit Performance

45

CPU ID Data

48

CPU code patch revision

49

Current Config Limit Data

54

RESERVED

54

Accumulated Energy Status

55

Accumulated CPU Energy

55

Accumulated CPU Throttle Time

57

2.5.2.7 RdIAMSR()

59

Cores 0,1.2...7

60

Thread (0,1) Mask for Core4

60

2.5.2.8 RdPCIConfig()

63

2.5.2.9 RdPCIConfigLocal()

64

DeviceBus Function Register

65

2.5.2.10 WrPCIConfigLocal()

66

2.5.3.1 Power-up Sequencing

68

2.5.3.2 Device Discovery

69

2.5.3.3 Client Addressing

69

2.5.3.4 C-states

70

2.5.3.5 S-states

71

2.5.3.6 Processor Reset

71

2.5.4 Multi-Domain Commands

73

2.5.5.1 Abort FCS

74

2.5.5.2 Completion Codes

74

2.5.7.1 Format

75

3 Technologies

77

3.1.2 Intel® VT-x Features

78

3.1.3 Intel® VT-d Objectives

78

3.2 Security Technologies

79

3.2.3 AES Instructions

80

3.3 Intel® Secure Key

81

3.4 Intel® OS Guard

81

Technologies

82

4 Power Management

85

Table 4-6. Intel® QPI States

87

4.2.2 Low-Power Idle States

88

Processor Package State

89

Core N State

89

Core 0 State

89

4.2.4.1 Core C0 State

90

4.2.4.2 Core C1/C1E State

90

4.2.4.3 Core C3 State

91

4.2.4.4 Core C6 State

91

4.2.4.5 Delayed Deep C-States

91

4.2.5.1 Package C0

93

4.2.5.2 Package C1/C1E

93

4.2.5.3 Package C2 State

94

4.2.5.4 Package C3 State

94

4.2.5.5 Package C6 State

94

4.2.7 Processor P

95

Power Specifications

95

4.3.1 CKE Power-Down

96

4.3.2 Self Refresh

96

4.3.2.1 Self Refresh Entry

97

4.3.2.2 Self Refresh Exit

97

4.3.2.3 DLL and PLL Shutdown

97

5 Thermal Management

98

5.1.5 Thermal Metrology

107

) Measurement Location

108

5.2.1 Processor Temperature

109

5.2.2.2 Clock Modulation

111

5.2.4 PROCHOT_N Signal

112

5.2.5 THERMTRIP_N Signal

112

6 Signal Descriptions

115

6.5 PECI Signal

118

6.7 JTAG and TAP Signals

119

Miscellaneous Signals

119

7 Electrical Specifications

124

BCLK{0/1}_DN)

125

7.1.6.1 PLL Power Supply

126

7.1.9.2 Decoupling Guidelines

127

Electrical Specifications

128

7.2 Signal Group Summary

132

7.5 Mixing Processors

136

7.8 DC Specifications

138

Figure 7-3. V

142

7.8.2 Die Voltage Validation

143

Time [us]

144

Unit Figure Notes

146

O_ABS_MAX

149

VHavg (mV)

150

250 + 0.5 (VHavg - 700)

150

550 + 0.5 (VHavg - 700)

150

7.9 Signal Quality

152

7.9.5.3 Activity Factor

154

1.3335 V 0.2835 V 3 ns 5 ns

155

1.2600 V 0.210 V 5 ns 5 ns

155

8 Processor Land Listing

157

8.2 Listing by Land Number

175

9 Package Mechanical

194

Intel® Xeon® Processor E5

195

9.7 Processor Materials

199

9.8 Processor Markings

199

10.1 Introduction

200

Solution)

201

Keepout Zones

203

Support (URS)

212

°C. Meeting the processor’s

213

10.4 Boxed Processor Contents

216

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